Plasma Cleaning Machine
Online Plasma Surface Cleaning Machine
This device is an online plasma surface treatment solution designed for SMT and semiconductor packaging processes. It utilizes low-temperature plasma to perform fine cleaning and activation on PCB and component surfaces, effectively removing organic contaminants, oxide layers, and particulate impurities, thereby significantly improving the adhesion and yield of subsequent bonding, coating, and soldering processes.
Online Plasma Surface Cleaning Machine
This device is an online plasma surface treatment solution designed for SMT and semiconductor packaging processes. It utilizes low-temperature plasma to perform fine cleaning and activation on PCB and component surfaces, effectively removing organic contaminants, oxide layers, and particulate impurities, thereby significantly improving the adhesion and yield of subsequent bonding, coating, and soldering processes. The equipment can seamlessly integrate into SMT production lines for continuous online treatment, meeting the precision process requirements of high-end electronic manufacturing.
1. Precision Non-Destructive Cleaning
Using low-temperature and atmospheric pressure plasma technology, the processing temperature is ≤50°C, causing no thermal damage to PCB substrates and sensitive components. It can thoroughly clean micron-level gaps, effectively removing organic contaminants, oxide layers, and fine dust particles, with a cleaning uniformity of ≥95%.
2. Surface Activation Modification
During the cleaning process, the material surface is activated and modified to enhance surface energy, significantly improving the adhesion of glue, ink, and solder. This reduces process defects such as cold soldering, delamination, and detachment, thereby enhancing the long-term reliability of the product.
3. Online Continuous Operation
Standard PCBA transfer rail, supporting SMEMA communication protocol, can be directly integrated into SMT production lines for continuous online processing, eliminating the need for additional loading and unloading procedures, suitable for high-volume automated production.
4. Precise and controllable process
Supports digital adjustment of parameters such as plasma power, processing speed, and gas flow rate. It can store multiple sets of process recipes, allowing one-click switching for different materials and process requirements to ensure process consistency and traceability.
5. Energy-saving and Environmental Protection Design
The low-power plasma generation device requires only compressed air and a small amount of process gas, eliminating the need for chemical reagents and avoiding waste liquid or gas emissions, complying with green manufacturing standards. Its operating cost is significantly lower than wet cleaning processes.
Core Technical Parameters
- Parameter ItemTechnical Specifications
- Effective Processing Width: 50~450mm (Customization Available)
- Processing height range: 10~100mm
- Transmission speed range: 0.5~15m/min
- Plasma type: Atmospheric low-temperature plasma
- Uniformity treatment ≥95%
- Surface treatment temperature ≤50℃
- Process gases: Compressed air, argon, nitrogen (optional)
- Power adjustment range: 0~2000W, stepless adjustment
- Transmission Method: Standard Rail Transmission, SMEMA Communication
- Operating power supply: AC 220V±10%, 50/60Hz
- Air source requirements: Clean compressed air at 0.4~0.6MPa
Applicable fields
Widely used in surface cleaning and activation processes for SMT pre-treatment, semiconductor packaging, COB bonding pre-treatment, automotive electronics, medical electronics, and precision optics.
Service and Support
- Provide free sample testing and customized process solutions.
- Professional engineers provide on-site installation, commissioning, and operational training.
- After-sales issues will be responded to within 2 hours and resolved within 24 hours.
- Core components warranty, lifetime maintenance and technical support.
- Global On-site Services and Process Upgrading Guidance.
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