SMT Stencil Printing Machine
Fully Automated Online High-Precision Dispensing Machine
Featuring a modular architecture, the equipment seamlessly integrates into SMT production lines, meeting the flexible mass production needs of multiple product categories. It provides high consistency and high yield dispensing process assurance for automotive electronics, semiconductors, precision communications, and other fields.
Fully Automated Online High-Precision Dispensing Machine
This device is an online precision dispensing solution designed for high-end PCBA manufacturing, integrating nanometer-level glue control, visual positioning, and intelligent trajectory planning. It can stably achieve various dispensing processes such as bottom filling, component encapsulation, selective coating, and structural sealing.
Featuring a modular architecture, the equipment seamlessly integrates into SMT production lines, meeting the flexible mass production needs of multiple product categories. It provides high consistency and high yield dispensing process assurance for automotive electronics, semiconductors, precision communications, and other fields.
Core performance advantage
1.Nanometer-level adhesive control precision
Equipped with a high-precision piezoelectric valve/screw valve dispensing system, it achieves a minimum dispensing volume of nanoliters, with dispensing point consistency deviation ≤±2%. Perfectly suited for micro-spacing and high-precision component dispensing requirements, it eliminates process defects such as stringing, glue overflow, and leakage.
2.Smart Vision Closed-loop System
Integrated with high-resolution industrial cameras and coaxial lighting, it supports automatic Mark point recognition, product positioning calibration, and glue path online inspection. No dedicated fixtures are required for rapid product changeover, achieving visual positioning accuracy of ±0.01mm.
3.Multi-process flexible compatibility
Supports various process modes such as bottom filling, corner dispensing, dam filling, and surface coating, compatible with mainstream adhesives including UV resin, epoxy adhesive, conductive adhesive, and thermal silicone, meeting the process requirements of different products and working conditions.
4.Online full-line interconnection
Standard SMEMA communication interface is included, enabling signal interconnection and data synchronization with SMT production line equipment. It supports seamless integration with upper/lower panel machines, reflow soldering, AOI, and other devices, adapting to fully automated production line layouts.
Digital Process Tracing
Equipped with an industrial-grade built-in control system, it supports digital storage and retrieval of glue path parameters, motion trajectories, and glue output, enabling seamless integration with MES systems for comprehensive production data traceability, meeting the management requirements of smart manufacturing factories.
Core technical parameters
- Parameter Item Technical Specification
- Effective working stroke: 400mm × 350mm (customization available)
- Positioning accuracy: ±0.01mm
- Repeatability ±0.005mm
- Minimum dispensing volume 0.001 μL (piezoelectric valve configuration)
- Maximum motion speed 800mm/s
- Applicable Adhesive Types: UV adhesive, epoxy adhesive, conductive adhesive, silicone, solder paste, etc
Visual System
- 5-megapixel industrial camera with coaxial light + ring light configuration
- Control Method: Industrial PC + Specialized Motion Control Software
- Communication Protocol SMEMA, supporting MES system integration
- Working power supply: AC 220V±10%, 50/60Hz
- Air source requirement: Clean compressed air at 0.4~0.7MPa
Applicable fields
The high-precision PCBA dispensing process is widely used in fields such as automotive electronics, semiconductor packaging, 5G communications, consumer electronics, industrial control, and security electronics.