Plasma cleaning machine
Pre processing of solder paste printing Plasma cleaning can remove oxides and organic pollutants (such as grease and dust) on the surface of solder pads, improve the wettability of solder pads, make solder paste more evenly spread, and reduce problems such as virtual soldering and empty soldering.For BGA (Ball Grid Array) packaging, plasma treatment can clean the solder pads and make their surfaces slightly rough, enhance the bonding force between solder balls and solder pads, and improve the success rate of mounting.
- Enhance material adhesion:
Preparation before coating with conformal coating, If there are pollutants or low surface energy areas on the POB surface, the three proof paint is prone to uneven coaling, blistering, and peeling, Plasma treatment can improve surface activity, ensure uniform adhesion of paint film, and enhance moisture and dust resistance.FPC (Flexible Circuit Board) processing Remove residual adhesive from the hole wall laser cut carbides, improve the adhesion of the copper plating layer, and avoid the problem of voids in the plating layer.
- Solve the problem of high-density interconnection:
Miniature components (such as 01005.CSP) Traditional cleaning methods (such as ultrasound) may damage small solder pads or fragile components (such as ceramic resonators), while plasma cleaning can accurately handle and avoid physical impacts.
HDI board and high-frequency PCB 5G'milimeter wave PCBS require extremely high cleanliness of the dielectric layer, and plasma treatment can reduce signal loss caused by pollutants (such as color noise insertion loss<0.1dB).
- Environmental protection and efficiency advantages:
Alternative chemical solvents Traditional cleaning relies on VOC emission solvents such as alcohol and acetone, while plasma cleaning uses inert gases such as Ar and 0, which have no chemical residues and comply with RoHS /REACH regulations.
Automation integration Online plasma equipment can be directly connected to SMT production lines (such as solder paste printing machines) to achieve seamless continuous production and improve efficiency.
Equipment parameters
Machine model:SX-D1000 Plasma cleaning machine
Equipment dimensions (mm):Length 1640mm* Width 1590mm* Height 1890mm
Equipment weight (KG):1200KG
Power parameters:220V AC (single-phase) 50/60HZ 3KW (energy-saving type)
Gas parameters:0.6Mpa-0.8Mpa 0.3m3/min
Environmental temperature for use:0-25°
Plasma power:750W-1000W
Equipment noise:70 decibels
safety protection: control system
theoretical speed:Security gates, software anti error algorithm protection
Substrate size (mm): Minimum 50mm * 50mm, maximum 430mm* 450mm
Substrate thickness (mm): Substrate thickness 0.97mm-2.36mm
Programming method: Panasonic sensors
Sensor brand: Full servo motor
Motor system: Industrial control computer Chinese/English operating system (Win10 system control platform)
High power plasma nozzle
Imported guide rail screw
Brushless stepper belt motor
